Abstract：The vitrified bond and related grinding wheel were prepared by melt-quench water method and sol-gel
method respectively. The effects of preparation technology on the phase, linear expansion coefficient, bending
strength and diamond dispersion of the binder were studied. The machining performance of ceramic bond pre‐
pared by different technology on PcBN tool was studied. The results show that SiO2 crystals precipitate in the
binder prepared by melt-quench water method, and the coefficient of SiO2 crystals increases the thermal expan‐
sion coefficient and decreases the bending strength of the binder. The agglomeration of M2.5/5 diamond in
fusion-quenched water bonding method reduces the holding force of the binder on diamond and increase the sur‐
face roughness of PcBN tool grinding.
2023, Vol. 33 
