Study on the failure cause of insulation resistance of soft magnetic materials for molded inductors
GUO Feng1， LI Wei-jian1， YAN Liang-ming2， LI Yuan-yuan1， WANG Xian1
（1. Global Vision Trading Ltd.， Kunshan City， Suzhou 215300， China 2. Material Science and Engineering Institute， Inner Mongolia University of Technology， Hohhot 010051， China）
Abstract：The reasons for the change of insulation resistance of molded inductor after low temperature baking were discussed， and the method to improve the insulation resistance was tried to found. It is found that the surface bonding strength between the metal soft magnetic powder and the coating layer increases firstly and then decreases with the increase of temperature， and the coating layer becomes brittle with the increase of temperature. The results show that the reason for the change of insulation resistance is that the volume change of the coating material in the curing process and the change of the surface bonding strength caused by the curing product， and the coating layer is more brittle with the higher curing degree， and the interaction between the two causes the coating layer to produce peeling or even peeling off， which results in the insulation resistance failure after baking.
郭 峰， 李伟健， 闫亮明， 李媛媛， 汪 贤. 模压电感用软磁材料的绝缘阻抗失效原因研究[J]. , 2016, 26(05): 29-32.
GUO Feng， LI Wei-jian， YAN Liang-ming， LI Yuan-yuan， WANG Xian. Study on the failure cause of insulation resistance of soft magnetic materials for molded inductors. , 2016, 26(05): 29-32.
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2016, Vol. 26 
