Abstract：Diamond/Cu composites were prepared via infiltration method using diamonds with surface modification as raw materials. The effect of particle size， diamond grade and coating thickness on the composites’ thermal conductivity （TC） and thermal expansion characteristics were studied. The results show that the TC of diamond/Cu composites increases with diamond particle size and diamond grade. The TC is 787 W/（m·K） when the thickness of chromium coating on diamond is 210 nm， and 633 W/（m·K） when the thickness is 150 nm， which indicates that too thin chromium coating on diamond leads to the decrease of composite thermal conductivity. The coefficient of thermal expansion （CTE） of diamond/Cu composites is among （3.00～8.00）×10－6 K－1 at temperature between 30～200 ℃，and increases with temperature increasing.
[1] Th. Schubert, B. Trindade, T. Wei?g¨arber, etc.. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J]. Materials Science and Engineering A 475 (2008) 39–44.[2] K. Hanada, K. Matsuzaki, T. Sano. Thermal properties of diamond particle-dispersed Cu composites[J]. Journal of Materials Processing Technology. 2004, s153-154(22)：514–518.[3] Zeinab Abdel Hamid, Sayed F. Moustafa, Fatma A. Morsy, etc. Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy [J]. Natural Science, 2011, 3(11): 936-947.[4]L Weber, R.Tavangar. On the influence of active element content on the thermal conductivity and chermal espansion of Cu-X(Cr, B)diamond composites[J]. Scripta Materialia, 2007, 57(11):988-991.[5] E.A. Ekimov, N.V. Suetin, A.F. Popovich, etc. Thermal conductivity of diamond composites sintered under high pressures[J]. Diamond & Related Materials, 2008, 17(4-5):838-843.[6] ?ukas Ciupiński, D. Siemiaszko, Marcin Rosiński,etc. Heat Sink Materials Processing by Pulse Plasma Sintering[J]. Advanced Materials Research, 2009, 59(2): 120-124.[7]陈超，郭宏，尹法章等. 颗粒粒径对Diamond_Cu-Cr复合材料组织与热物能的影响[J]. 材料工程，2010增刊1: 73-77.[8]陈惠，贾成厂、褚克，等. 通过改善界面状态提高金刚石-Cu复合材料导热性的研究[J]. 粉末冶金技术, 2010, 28(2): 143-149.[9]张习敏，郭宏，尹法章，等. Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响[J]. 稀有金属，2010,34（2）：221-225.[10] 张习敏，郭宏，尹法章，等. 金刚石/铜复合材料界面结合状态的改善方法[J]. 稀有金属，2013,37（2）：335-340.
2018, Vol. 28 
