Abstract：Using Fe-Ni-Cu-Si as interlayer solder, W and W-10% Cu (W-10Cu) composite was fabricated through vacuum pressure diffusion bonding method. The effects of Si content in the interlayer solder on the microstructure and mechanical properties of the W/W-10Cu diffusion bonded joints was studied under the conditions of welding temperature of 1 050 ℃, holding time of 60 min and pressure of 20 MPa. The results show that the width of the diffusion layer gradually widens with the increase of Si content. When the mass percent of Si is 1.0%, a W-Ni-Fe diffusion layer with continuous composition distribution is formed at the interface. The hardness distribution shows a continuous and smooth trend, and the tensile strength reaches the maximum value of 296 MPa.
闫海祥，范景莲. Si含量对W/W-10Cu扩散焊接头的微观结构及力学性能的影响?[J]. 粉末冶金工业, 2019, 29(03): 8-12.
YAN Hai-xiang, FAN Jing-lian. Effect of Si content on the microstructure and mechanical properties of W/W-10Cu diffusion bonded joint. Powder Metallurgy Industry, 2019, 29(03): 8-12.
2019, Vol. 29 
