Thermal deformation behavior and constitutive relationship ofW-20Cu
composites
WANG Linghao1，WU Xianming1，2，MO Yumei1
1Department of Industrial Automation，Guang Dong Polytechnic College，Zhaoqing 526100，China；
2School of materials science and engineering，HunanUniversity of science and technology，Xiangtan 411201，
China
Abstract：The high temperature thermal deformation behavior of W-20Cu composites at strain rates ranging from
0.01-5 s-1 and temperature ranging from 800-1 000 ℃ was studied by thermal simulation compression test. The microstructure
after material compression deformation was observed and studied by SEM. The results show that W-
20Cu composites have high strain rate strengthening effect and temperature softening effect. The ideal condition
for thermal deformation processing is 900-950 ℃, and the strain rate should below 1 s-1. In the process of material
thermal deformation, there is an obvious Cu stripe aggregation phenomenon, which promotes the densification of
materials, and the densification effect of high temperature and low strain rate is more significant. The Arrhennius
constitutive equation of the material is established by using the experimental data and the polynomial function relation
of true strain is modified and fitted to the parameters of the equation. Through comparative analysis, the modified
constitutive equation can describe the high temperature rheological behavior of materials well.
2021, Vol. 31 
