Microstructure and property analysis of W-7Cu-xNi alloy prepared by liquid phase sintering for power switch
HAN Junfeng1，MAYuechao2，JIANG Ziming3
（1. Department of Electrical Engineering, Baotou Polytechnic, Baotou 014035, China; 2. School of Energy and
Power Engineering, Inner Mongolia University of Technology, Hohhot 010000, China;3. Power Engineering
Technology Research Institute of Inner Mongolia Energy Power Generation Investment Group Co., LTD, Hohhot
010000, China）
Abstract：In order to improve the comprehensive properties of W-7Cu alloy used for power switch, the w-Cu alloy
containing different Ni contents was prepared by liquid phase sintering and mechanical ball milling.The microstructure,
phase structure, hardness and thermal conductivity were measured by electron microscope, X-ray diffractometer,
hardness tester and laser thermal conductivity tester.The results show that the larger size W particles are formed
and the spacing between adjacent particles decreases with the increase of Ni content.The interface of W-Cu-4%Ni
alloy forms a better wettability angle and obtains a continuous network distribution of copper phase, which improves
the distribution uniformity of W-Cu microstructure. At this time, Ni element is completely dissolved with
Cu phase. With the increasing of Ni content, the hardness and density of W-Cu alloy are higher, the thermal conductivity
decreases, and the relative density increases. When 4% Ni is added, the density reaches 95.6%, the thermal
conductivity decreases from 161 W/(m?K) to 96. 4 W/(m?K), and the alloy with higher density is obtained.
2023, Vol. 33 
