Research progress in preparation of high thermal conductivity copper matrix composites by powder metallurgy
BAO Rui1，2，3，LI Zhaojie1，YI Jianhong1，2，3，TAO Jingmei1，2，3，GUO Shengda2，3
（1. School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming
650093, China; 2. Engineering Research Center of Tungsten Resources High-efficiency Development and Appli‐
cation Technology of the Ministry of Education, Jiangxi University of Science and Technology, Ganzhou 341000,
China; 3. Key Laboratory of Advanced Materials of Yunnan Province, Kunming University of Science and Tech‐
nology, Kunming 650093, China）
Abstract：With the rapid development of network communication, the increase of the unit heat production power
of electronic chips puts forward higher requirements on the heat dissipation capacity of thermally conductive mate‐
rials. Traditional metal thermally conductive materials can no longer meet the requirements for use, and it is immi‐
nent to develop new thermally conductive materials. The copper matrix composite material with excellent thermal
conductivity and mechanical properties is used as the matrix, and the copper matrix composite material obtained by
adding the reinforcement with high thermal conductivity and low expansion can take into account the characteris‐
tics of adjustable thermal expansion coefficient and high thermal conductivity. Based on the common characteris‐
tics of high thermal conductivity and low expansion, copper-based composite materials such as carbon material/
copper, silicon carbide/copper, diamond/copper, etc. are widely used as ideal heat dissipation materials in the fields
of semiconductor preparation, aerospace, and military defense. The types of reinforcements are classified, focusing
on the research progress of copper matrix composites with diamond, graphene, graphite, carbon nanotubes and SiC
as reinforcements in recent years, and the current problems and problems of high thermal conductivity copper ma‐
trix composites. Future research directions are prospected.
2022, Vol. 32 
