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Finite element analysis for the effective thermal conductivity of copper foam |
LI Yu,SHEN Wei,ZHAO Peng,PU Yu-ping |
(High Temperature Materials Research Institute, Central Iron & Steel Research Institute, Beijing 100081, China) |
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Abstract With the aid of X-ray micro-computed tomography and digital image processing technology, three-dimensional structure of copper foam prepared by electro deposition process was reconstructed. Furthermore, a simplified finite element model of copper foam was proposed, which can reflect the structure of copper foam more truly. On the basis of Fourier heat conduction equation, the finite element method was applied in finite element analysis for the effective thermal conductivity of copper foam. In the meanwhile, a quantitative relation between effective thermal conductivity and porosity of the copper foam was established, and the relationship between the thermal stress and the single cell model of copper foam was studied.
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Received: 08 October 2016
Published: 18 April 2018
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