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| Particulate scale numerical simulation of W and Cu composite powders forming process |
| SUN Mengli1，HAN Peng1，XU Yingshi2 |
| （1.School of Materials and Metallurgy, University of Science and Technology Liaoning, Anshan 114000, China;
2.Angang Steel Company Limited, Anshan 114000, China） |
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Abstract In this paper, 2D compaction of tungsten and copper composite powders was simulated by multi-particle
finite element method. The effects of copper powder content and pressure on relative density and distribution,
stress and distribution, particle deformation, void filling behavior, and force transmission in the compact during
compaction were systematically studied and analyzed. The results indicate that force is mainly concentrated inside
tungsten particles forming the contact force network which impedes the compaction densification. During compac‐
tion, void filling is mainly implemented by the deformation of copper particles, and the contacting tungsten parti‐
cles produce small void that are difficult to fill. The stress at the edge of tungsten and copper particles is higher
than that at the center of particles. With the increase of the compression pressure, the stress in the center of the cop‐
per particles increases more slowly than that in the tungsten particles, and the stress value at the edge of the tung‐
sten particles along the compression direction is much greater than that at the center of the particles. According to
the comprehensive analysis, the deformation characteristics of tungsten particles are the key factors hindering the
densification process, and the arrangement structure of tungsten particles should be optimized to achieve high per‐
formance compact.
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Received: 17 August 2022
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2023, Vol. 33 
