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| Study on sintering performance of ultrafine copper powder in conductive paste |
| LEI Xiao-xu1,2,3, LIU Wen-ping1,2,3, QIN Hai-qing1,2,3, LIN Feng1,2,3 , ZHANG Zhen-jun1,2,3, ZHANG Jian-wei1,2,3 |
1. China Nonferrous Metal Guilin Geology and Mining Co., Ltd., Guilin 541004, China
2. National Engineering Research Center for Special Mineral Material, Guilin 541004, China
3.Guangxi Key Laboratory of Superhard Material, Guilin 541004, China |
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Abstract In order to obtain the metal ultrafine copper conductor paste, the ultrafine copper powder was prepared by direct current arc plasma evaporation method, the crystalline structure and morphology of copper powder were characterized by X-ray diffraction(XRD), field emission scanning electron microscope (FESEM). With acrylic resin, ethyl cellulose and terpineol as organic carrier, ultrafine copper powder (mass percent of 70%) as conductive phase, the copper conducting pastes were prepared. The conductive properties and morphology of pastes under different sintering temperature (450~600 ℃) and holding time (15~60 min) were studied. The results show that the sintering process has a great influence on the conductive properties of the paste. As the sintering temperature and holding time increase, the square resistance of conductive copper paste reduces gradually, and the conductivity of the paste is enhanced. The conductive copper paste sintered at 600 ℃ for 60 min has the square resistance of 14.8 m Ω /□.
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Received: 11 April 2014
Published: 16 October 2014
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2014, Vol. 24 
