|
|
|
| Effects of gas atomization pressure on the characteristics of Sn0.3Ag0.7Cu lead-free solder powder |
| HAN Shuai,ZHAO Mai-qun,WANG Zi-yu,LI Shao-meng |
| （School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China） |
|
|
|
|
Abstract Sn0.3Ag0.7Cu lead-free solder powders were prepared by supersonic gas atomization equipment. The scanning electron microscope and laser particle size analyzer were used to characterize the microstructure and size distribution of the powder, respectively. The method of mass difference after reaction between solder powders was used to calculate the oxygen content of powders. The effects of gas pressure on the effective atomization rate, powder microstructure, size distribution and oxygen content were investigated. The results indicate that the gas pressure has great influence on the effective atomization rate, powder microstructure and size distribution of the powders. The effective atomization rate increases with the gas pressure increasing. The sphericity of the powders is better under higher gas pressure, while it is best when the gas pressure is 0.6 MPa. The powder size becomes smaller as the gas pressure increasing, which decreases slowly under higher pressure. The oxygen content of the powders increases slightly with the gas pressure increasing, causing bad powder surface.
|
|
Received: 10 July 2014
Published: 29 July 2015
|
|
|
|
| [1]Niwat Mookam, Kannachai Kanlayasiri.Evolution of Intermetallic Compounds between Sn-03Ag-0.7Cu Low-silver lead-free solder and Cu Substrate during Thermal Aging[J].Material Science and Technology, 2012, 28(1):53-59[2] Yuki Fukuda, Michael G.Pecht, et al. Lead-free soldering in the Japanese Electronics Industry[J].Transactions on components and packaging technologies, 2003, 26(3):616-623[3]张群超，张富文，胡强．.低银Sn-Ag-Cu无铅钎料的发展现状及发展趋势[J][J].焊接, 2011, 11:28-31[4]赵麦群，赵高扬，于喜良等.无铅焊锡合金粉末超音速雾化技术的研究[J].粉末冶金技术, 2003, 21(2):96-98[5]许天旱，赵麦群， 邸小波等.过热度对无铅焊锡雾化粉末特性的影响[J].材料导报, 2005, 19(4):128-130[6]刘文胜，彭芬，马运柱.工艺条件对气雾化制备合金粉末特性的影响[J].中国有色金属学报, 2009, 19(6):1074-1079[7]高飞山.SnPb焊锡微粉的超音速雾化制备及其分级研究[D]., 2013, :-[8] Tianhan Xu, Haiyun Jin, Maiqun Zhao et al.Influences of Atomization Pressure on Properties and Microstructure at Brazed Joint of Lead-free Solder Powder [J].Materials Science Forum, 2011, 695:89-92[9] Renaud Metz, Celine Machado, Mourad Houabes et al.Nitrogen spray atomization of molten in metal: powder morphology characteristics[J].Journal of Materials Processing Technology, 2007, 189:132-137[10]许天旱，王党会.过热度对合金雾化粉体颗粒形貌的影响[J].机械工程材料, 2010, 34(1):24-27[11] Tianhan Xu, Maiqun Zhao, Danghui Wang.Influences of Atomizing Pressure on Preparation Processing of Lead-free Solder powder[J].Advanced Materials Research, 2011, 183(185):2091-2094[12]朱盼星，张少明，徐骏等.气雾化参数对不锈钢粉末粒度的影响[J].粉末冶金材料科学与工程, 2010, 15(4):388-393[13]普友福，朱华明，武信.用焊锡粉生产技术现状及发展趋势分[J].云南冶金, 2012, 41(3):47-51[14] Mulugeta Abtewa, Guna Selvaduray.Lead-free Solders in Microelectronics[J].Materials Science and Engineering R, 2000, 27:95-141[15] Xin Luo, Wenhui Du, Xiuzhen Lu, et al.Surface oxide analysis of lead-free solder particles[J].Soldering & Surface Mount Technology, 2013, 25(1):39-44 |
|
|
|
2015, Vol. 25 
