|
|
|
| Effect of trace Ge on interfacial IMC of Sn-0.7Cu solder under high soldering temperature |
| MENG Guo-qi1，CHEN Duan-feng1，GAN Gui-sheng1,2，LIU Lu-ting1，LIU Zhao-wei1，WANG Qing-meng1 |
1. Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology， Chongqing University of Technology， Chongqing 400054， China
2. College of Materials Science and Engineering， Huazhong University of Science and Technology， Wuhan 430074， China |
|
|
|
|
Abstract The wettability of Sn-0.7Cu and Sn-0.7Cu-0.012Ge solders were measured under different soldering temperature， and the influence of trace Ge on interfacial IMC growth rate during aging process was also investigated. The results show that， Sn-0.7Cu-0.012Ge and Sn-0.7Cu solders have no obvious difference in their wettability， but the overflow property of Sn-0.7Cu-0.012Ge solder is significantly improved by about 4.00%-5.00% with the addition of Ge element. During the aging test at the temperature of 150 ℃， the interfacial IMC growth rate of Sn-0.7Cu/Cu at the soldering temperature of 250 ℃ and 350 ℃ are 3.24×10－18 m2/s and 2.50×10－17 m2/s， respectively， while Sn-0.7Cu-0.012Ge/Cu are 2.66×10－18 m2/s and 1.48×10－17 m2/s， respectively. The accumulation of Ge element in soldering interface can effectively improve the density of the interfacial IMC， hinder?the diffusion of atoms， thus inhibit the interfacial IMC layer coarsen and thicken to a certain extent.
|
|
Received: 03 December 2015
Published: 12 June 2016
|
|
|
|
|
|
|
2016, Vol. 26 
