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  2018, Vol. 28 Issue (02): 39-44    DOI: 10.13228/j.boyuan.issn1006-6543.20160112
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Finite element analysis for the effective thermal conductivity of copper foam
LI Yu,SHEN Wei,ZHAO Peng,PU Yu-ping
(High Temperature Materials Research Institute, Central Iron & Steel Research Institute, Beijing 100081, China)
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