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| Study on the preparation and bonding properties of tungsten coating on oxygen-free copper substrate |
| ZHANG Dan-hua, QIN Si-gui, LIU Guo-hui |
| ATTL Advanced Materials Co., Ltd., Beijing 100094, China |
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Abstract Tungsten coating was prepared on oxygen-free copper surface by chemical vapor deposition ( CVD ) process, and copper-tungsten composite interface was heat treated by hot isostatic pressing diffusion bonding process to obtain copper-tungsten composite material. SEM and metallographic microscope were used to observe the micro-morphology of the coating and copper-tungsten interface. Adhesion and brazing were used to evaluate the bonding strength of copper-tungsten interface. The results show that the microstructure of tungsten coating is columnar crystal with uniform coating thickness and interface. During the bonding strength test, the coating does not peel off or damage, indicating that the bonding strength of tungsten-copper interface is greater than that of adhesive interface and brazing interface.
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Received: 18 January 2018
Published: 25 April 2019
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2019, Vol. 29 
