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| Effect of Si content on the microstructure and mechanical properties of W/W-10Cu diffusion bonded joint |
| YAN Hai-xiang, FAN Jing-lian |
| State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
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Abstract Using Fe-Ni-Cu-Si as interlayer solder, W and W-10% Cu (W-10Cu) composite was fabricated through vacuum pressure diffusion bonding method. The effects of Si content in the interlayer solder on the microstructure and mechanical properties of the W/W-10Cu diffusion bonded joints was studied under the conditions of welding temperature of 1 050 ℃, holding time of 60 min and pressure of 20 MPa. The results show that the width of the diffusion layer gradually widens with the increase of Si content. When the mass percent of Si is 1.0%, a W-Ni-Fe diffusion layer with continuous composition distribution is formed at the interface. The hardness distribution shows a continuous and smooth trend, and the tensile strength reaches the maximum value of 296 MPa.
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Received: 31 January 2019
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2019, Vol. 29 
