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| Microstructure and properties of SiCp/Cu composites prepared by powder
metallurgy |
| ZHANG Xiaohong1，SUN Shangqing2，WANG Zhengran2，HU Lianxi2 |
| 1，Wuxi Institute of Technology，Wuxi 214121，China; 2，National Key Laboratory for Precision Hot
Processing of Metals，Harbin Institute of Technology，Harbin 150001，China） |
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Abstract SiC particle dispersion strengthened copper matrix (SiCp/Cu) composites using high purity SiC powder
and Cu powder as raw materials were prepared by mechanical ball milling and vacuum hot pressing sintering. SEM
and XRD were used to study the change of powder morphology, powder uniformity and average particle size during
ball milling. At meantime, the microstructure, mechanical properties and physical properties of SiCp/Cu composites
prepared by vacuum hot pressing sintering process were studied. The results show that the composition of
SiCp/Cu composite powder is uniform after 10 h ball milling with the ball milling speed of 250 r/min and the ratio
of ball to material 10:1 (mass ratio). The relative density of the composites prepared by vacuum hot pressing sintering
is more than 92%, and the SiC reinforced particles are evenly distributed, which has good mechanical properties
and thermal conductivity. Among which, the composite prepared at 850 ℃ for 1 h has better comprehensive
properties, with density of 96.2%, thermal conductivity of 221.346 W/(m · K), conductivity of 65.3%IACS, compressive
strength of 467.46 MPa and fracture strain of 20.87%.
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Received: 25 December 2020
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Corresponding Authors:
胡连喜（1961—），男，教授，博士生导师，主要研究方向为粉末冶金与材料制备成形等。
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2021, Vol. 31 
