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| Research progress on fine metal powder materials for electronic paste |
| LIU Xiangqing1，2,3.，SUN Haixia1，3.，JIANG Zhi3.，ZHANG Xu1，3.，ZHANG Bin1，3.，
WANG Jianwei4.，HE Huijun1，2.，WANG Limin1，2. |
| （1. GRIPM Advanced Materials Co., Ltd., Beijing 101407; 2. Technical Research Institute of Metal Powder Ma‐
terial Industry, Beijing 100088, China; 3. GRIPM Advanced Materials (Hefei) Co. Ltd., Heifei 230012, China;
4. GRIPM Research Institute Co., Ltd., Beijing 101407, China） |
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Abstract Electronic paste is the fundamental material of IT industry, widely used in aviation, aerospace, IT, com‐
munication device, automobile industry and many other fields. With the rapid and high integrated development of
IT industry, as a conductive phase metal powder materials require high purity, controllable shape, free-agglomera‐
tion, controllable size and narrow distribution, and low oxygen content. This paper summarizes the main uses of
electronic paste and analyses the preparation methods of fine metal powder materials. It is suggested the prepara‐
tion technology, development direction and applications of spherical and flake fine metal powder materials
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Received: 18 May 2023
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Corresponding Authors:
汪礼敏（1964—），男，博士，正高级工程师，主要研究方向为有色金属粉体材料及其应用。
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2023, Vol. 33 
