Abstract：The effects of melt structure transformation and Ce addition on properties of Sn-3.8Ag-0.7Cu-xCe solder were investigated.The results show that there exists a temperature-induced liquid-liquid structure transformation in Sn-3.8Ag-0.7Cu-xCe solder melt, and the solidification microstructure of solder becomes refined and distributes more uniformly after overheating processing. Wetting Properties of solder and the shear strength of soldered joint has also been improved. At the same time, the melt structure transition could improve the form of interface IMC in soldered joint. The addition of rare earth element Ce has an influence on the solidification structure of solder. Wetting properties of solder and the shear strength of welding joint increase first and then decrease with Ce increasing. When Ce addition is 0.2%(mass fraction), the wet ability of solder is the best, and the shear strength of soldered joint is the highest. Overall, melt structure transformation and the trace addition of Ce could improve the performance of Sn-3.8Ag-0.7Cu solder, and 0.2%Ce(mass fraction) addition is preferred.
收稿日期: 2017-01-07
出版日期: 2017-07-03
通讯作者:
李先芬
E-mail: lxfytt@163.com
引用本文:
潘龙凯，李先芬，范曼杰，陈欣，李昱坤，李根，许苏. 熔体结构?涠許n-Ag-Cu-xCe钎料性能的影响[J]. , 2017, 24(3): 45-51.
PAN Long-kai，LI Xian-fen，FAN Man-jie，CHEN Xin，LI Yu-kun，LI Gen，XU Su. The effect of melt structure transformation on properties of the Sn-Ag-Cu-xCe solders. , 2017, 24(3): 45-51.
[1] 洗爱平，王连文．液态金属的物理性能[M]．武汉：科学出版社，2006：1-40．[2] Li XianFen , Zu FangQiu , Ding HouFu , Yu Jin ,Liu Lan-Jun ,Li Qiang ,Yi Xun .Anomalous change of electrical resistivity with temperature in liquid Pb-Sn alloys [J]. Physica B 358 (2005):126–131.[3] Zu FangQiu ,Xi Yun ,Shen RongRong ,Li XianFen ,Zhang Yan and Chen ZhiHao .Effects of compound formation on liquid structure in Cu-Sn melts as a function of temperature [J]. Physics and Chemistry of Liquids Vol. 44, No. 5, October 2006 , 543–550.[4] Wang Li ,Bian XiuFang ,Liu JianTong . Discontinuous structural phase transition of liquid metal[J]. Physics Letters A 326 (2004) 429–435.[5] Zu FangQiu ,Li XianFen ,Guo LiJun ,Yang Hua ,Qin XuBo ,Zhu ZhenGang . Temperature dependence of liquid structures in In–Sn20: diffraction experimental evidence [J]. Physics Letters A 324 (2004) 472–478.[6] Yu Jin,Zhang Yan ,Zu FangQiu ,Xi Yun ,Li XianFen ,Xu Wei and Liu HaiMing . The abnormal changes of electrical resistivity in liquid Pb–In alloys[J]. Physics and Chemistry of Liquids Vol. 44, No. 4, August 2006, 401–408.[7] Liu XiuFang ,Wang WeiMin . Thermal-rate treatment and structure transformation of Al–13 wt.% Si alloy melt[J]. Materials Letters 44 , 2000,54–58.[8] 李先芬．共晶系和匀晶系二元合金熔体结构转变及其对凝固的影响[D]．合肥:合肥工业大学，2006：52-53． [9] Hafner, A Philipp, Low-temperature electrical resistivity of amorphous Ca-Mg alloys, J. Phys. F: Met. Phys. 14(1984), pp.1685-1691. [10] 陈杰，Cu-Sn/Sb及Pb-Bi/Sb合金熔体结构转变的可逆性及其对凝固的影响. 合肥工业大学博士学位论文，2009.[11] Guang C., Y. Jianwei, and F. Hengzhi. Influence of the Melt Heat History on the Solid/Liquid Interface Morphology Evolution in Unidirectional Solidification [J]. J.Mater. Sci. Lett., 1999, 18(19): 1571-1573.[12] H.L.J. Pang, K.H. Tan, X.Q. Shi, et al. Microstructure and intermetallic growth effects on shear and fatigue of solder joints subjected to thermal cycling aging. Mater. Sci. Eng. A, 2001,307(1): 42- 50.[13] T.Young. An Essay on the Cohesion of Fluids . Philos. Trans. R. Soc.London, 1805, 95:65-87.[14] J.C.M. Li, in: S. Ankem, et al. (Eds.), Proceedings of the International Symposium in Honor of Dr. Bhakta Rath on Science and Technology of Interfaces, TMS, 2002: 155–169.
2017, Vol. 24 
