Abstract:Reduced graphene oxide (RGO)/copper nanocomposite specimens were prepared by molecular-level mixing process in different solutions temperatures (40°C, 60°C, 80°C, 100°C). The microstructure of the composite powders under different preparation conditions was analyzed by atomic force microscopy (AFM), scanning electron microscopy (SEM), Raman spectroscopy and XRD. The nanocomposites specimens were investigated for electrical and thermal conductivity and mechanical properties to determine the relatively suitable preparation solution temperatures of RGO/Cu nanocomposites. The results show that when the solution temperature reaches 80 °C, the copper coating could cover the surface of RGO uniformly and densely, effectively preventing its agglomeration and obtaining good interfacial bonding, thus obtaining relatively good physical and mechanical properties. The hardness of the composite prepared with 1.0 vol% RGO was 90% higher than that of pure copper, and the tensile strength was 28.8% higher than that of pure copper.Conductivity (89% IACS) and thermal conductivity (350 W.m-1.K-1) also reach optimum values. Excessive solution reaction temperature is not conducive to obtaining the best physical and mechanical properties.