Abstract：The Sn0.3Ag0.7Cu lead-free solder powder was prepared with supersonic gas atomization device to study the effects of different pressure states inside the atomization chamber on the atomization process of powder. The results show that conical atomization area tends to disorder from stable state with the atomizing chamber pressure increasing, moreover, the conical atomization area becomes larger gradually, gas-liquid flow ratio also increases, and the sphericity degree of atomized powder becomes better firstly and then worse. When the pressure inside the chamber is 0.05 MPa, the conical atomization area is stable and has large area, the sphericity degree of atomized powder is the best.
王子逾，赵麦群，韩 帅，吴道子，赵 振. 雾化室内气压对Sn0.3Ag0.7Cu焊锡粉末雾化过程的影响[J]. , 2015, 25(05): 17-21.
WANG Zi-yu, ZHAO Mai-qun, HAN Shuai, WU Dao-zi, ZHAO Zhen. Effect of atomizing chamber pressure on the atomization process of Sn0.3Ag0.7Cu solder powder. , 2015, 25(05): 17-21.
2015, Vol. 25 
