Abstract：Sn0.3Ag0.7Cu lead-free solder powders were prepared by supersonic gas atomization equipment. The scanning electron microscope and laser particle size analyzer were used to characterize the microstructure and size distribution of the powder, respectively. The method of mass difference after reaction between solder powders was used to calculate the oxygen content of powders. The effects of gas pressure on the effective atomization rate, powder microstructure, size distribution and oxygen content were investigated. The results indicate that the gas pressure has great influence on the effective atomization rate, powder microstructure and size distribution of the powders. The effective atomization rate increases with the gas pressure increasing. The sphericity of the powders is better under higher gas pressure, while it is best when the gas pressure is 0.6 MPa. The powder size becomes smaller as the gas pressure increasing, which decreases slowly under higher pressure. The oxygen content of the powders increases slightly with the gas pressure increasing, causing bad powder surface.
韩 帅，赵麦群，王子逾，李少萌. 雾化气体压力对Sn0.3Ag0.7Cu焊锡粉末特性的影响[J]. , 2015, 25(04): 20-25.
HAN Shuai,ZHAO Mai-qun,WANG Zi-yu,LI Shao-meng. Effects of gas atomization pressure on the characteristics of Sn0.3Ag0.7Cu lead-free solder powder. , 2015, 25(04): 20-25.
2015, Vol. 25 
