粉末冶金工业
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  2017, Vol. 27 Issue (03): 44-48    DOI: 10.13228/j.boyuan.issn1006-6543.20160043
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Microstructure and mechanical properties of architectural solder joint
ZHANG Yi
School of Civil Engineering and Architecture, Hubei University of Arts and Science, Xiangyang 441053, China
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