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| Research progress on HIP diffusion bonding of molybdenum alloys |
| WANG Tiejun1，2，3，ZHANG Longge1，2，3，CHE Hongyan2，3，DU Yaxiong4，LI Lin4 |
| 1Central Iron and Steel Research Institute，Beijing 100081，China；2Advanced Technology and Materials
Limited Company，Beijing 100081，China；3Engineering and Technology Research Center of Hot Isostatic
Pressing，Baoding 072750，China；4Beijing System Design Institute of Electro-mechanic Engineering，
Beijing 100854，China |
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Abstract In this paper，the mechanism of diffusion bonding and the process characteristics of HIP are briefly analyzed.
The application of diffusion bonding technology in molybdenum alloys is introduced from the aspects of the
selection of intermediate layer system and process parameters. Finally，the currently process progress is summarized
and the future development trend is prospected.
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Received: 13 June 2019
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2020, Vol. 30 
