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| Effect of compaction pressure on microstructure and properties of mechanically alloyed Cu20Fe80 alloy during microwave sintering |
| WANG Bo1，WANG Yang1，DONG Zhong-qi2，YIN Su-hua2，FU Jun-wei2 |
（1. School of Materials Science and Engineering， Hebei University of Science and Technology， Shijiazhuang 050000， China
2. Engineering Research Institute， Hebei College of Industry and Technology， Shijiazhuang 050091，China） |
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Abstract Cu20Fe80 alloy was prepared by mechanical alloying， cold pressing and microwave sintering. The microstructure and phase composition of Cu20Fe80 alloy were analyzed by SEM and X-ray diffraction. The density and hardness of the alloy were determined， and the microstructure evolution during the preparation process was studied. The results show that the microstructure of Cu20Fe80 alloy is lamellar. With the increase of pressing pressure， the Cu20Fe80 alloy compacts gradually become dense， and the formability of the alloy increases. After microwave sintering， the microstructure of the alloy is also lamellar. With the increase of pressing pressure， the grain boundary becomes obvious， the porosity decreases， the density and the hardness increase.
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Received: 20 January 2017
Published: 26 June 2018
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| [1]贾成厂.烧结金属含油轴承[J]. 粉末冶金，2011，22(1)：28-34.[2] 苏柏万，焦明华，王玉良，李凌鑫，尹延国. 铜对高硼铁基轴承材料组织及摩擦学特性的影响[J].轴承，2015，年1期，32-36.[3] 符寒光，胡开华.高硼铸造耐磨合金研究的进展[J].现代铸铁，2005(3) :32-37.[4] Tong An, Fei Qin. Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates[J]. Microelectronics Reliability, 2014 (54) : 932-938.[5] Liu Y, Li B H, Li J, et al. Effect of Titanium on the ductilization of Fe-B alloys with high boron content [J]. Materials Letters, 2010, 64: 1299-1301.[6] X.L. Yan , M. Lin. J.Y.Wang. Equilibrium and kinetic surface segregations in Cu–Sn thin films [J]. Appl Phys A, 2013, (113) : 423–430. |
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2018, Vol. 28 
