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Effect of trace added Ni on sintering behaviors and physical properties ofW-Cu
nano-composite |
LU Shangzhi,ZHANG Chunrui,GAO Bingxiang,ZHANG Jianghai,GUO Yajie |
School of Materials Science and Engineering, Chang’an University, Xi’an 710064, China |
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Abstract Tungsten-copper nanocomposite powder was prepared by chemical coprecipitation combined with hydrogen
reduction process, and the rapid sintering ofW-Cu nanocomposite powder was realized by spark plasma sintering
technology at different temperatures. The effects of trace active agent Ni addition on the morphology, sintering
behavior and alloy properties of W-Cu composite powders were studied. The results show that the addition of a
trace amount of of Ni (0.5%) makes the particle size of the composite powder grow more fully and the particle distribution
is more uniform; When the sintering parameters are the optimal, with the temperature of 970 ℃, pressure
of 120 MPa, and heat preservation time of 10 min, the average grain size of W particles in the W-20%Cu-0.5%Ni
alloy is 362.9 nm , the relative density is 97.7%, the porosity is 2.1%, the microhardness is 474.74HV, the above
properties are better than theW-20%Cu alloy prepared by the same SPS process.
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Received: 03 July 2020
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