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| Effect of atomizing chamber pressure on the atomization process of Sn0.3Ag0.7Cu solder powder |
| WANG Zi-yu, ZHAO Mai-qun, HAN Shuai, WU Dao-zi, ZHAO Zhen |
| School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China |
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Abstract The Sn0.3Ag0.7Cu lead-free solder powder was prepared with supersonic gas atomization device to study the effects of different pressure states inside the atomization chamber on the atomization process of powder. The results show that conical atomization area tends to disorder from stable state with the atomizing chamber pressure increasing, moreover, the conical atomization area becomes larger gradually, gas-liquid flow ratio also increases, and the sphericity degree of atomized powder becomes better firstly and then worse. When the pressure inside the chamber is 0.05 MPa, the conical atomization area is stable and has large area, the sphericity degree of atomized powder is the best.
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Received: 20 August 2014
Published: 05 November 2015
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2015, Vol. 25 
