雾化室内气压对Sn0.3Ag0.7Cu焊锡粉末雾化过程的影响
王子逾，赵麦群，韩 帅，吴道子，赵 振
Effect of atomizing chamber pressure on the atomization process of Sn0.3Ag0.7Cu solder powder
WANG Zi-yu, ZHAO Mai-qun, HAN Shuai, WU Dao-zi, ZHAO Zhen
.
2015, (05): 17
-21
.
DOI: 10.13228/j.boyuan.issn1006-6543.20140071
