Effects of gas atomization pressure on the characteristics of Sn0.3Ag0.7Cu lead-free solder powder

HAN Shuai,ZHAO Mai-qun,WANG Zi-yu,LI Shao-meng

Powder Metallurgy Industry ›› 2015, Vol. 25 ›› Issue (04) : 20-25.

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Powder Metallurgy Industry ›› 2015, Vol. 25 ›› Issue (04) : 20-25. DOI: 10.13228/j.boyuan.issn1006-6543.20140060

Effects of gas atomization pressure on the characteristics of Sn0.3Ag0.7Cu lead-free solder powder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 25(04): 20-25 https://doi.org/10.13228/j.boyuan.issn1006-6543.20140060

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