Effect of atomizing chamber pressure on the atomization process of Sn0.3Ag0.7Cu solder powder

WANG Zi-yu, ZHAO Mai-qun, HAN Shuai, WU Dao-zi, ZHAO Zhen

Powder Metallurgy Industry ›› 2015, Vol. 25 ›› Issue (05) : 17-21.

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Powder Metallurgy Industry ›› 2015, Vol. 25 ›› Issue (05) : 17-21. DOI: 10.13228/j.boyuan.issn1006-6543.20140071

Effect of atomizing chamber pressure on the atomization process of Sn0.3Ag0.7Cu solder powder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 25(05): 17-21 https://doi.org/10.13228/j.boyuan.issn1006-6543.20140071

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