Effect of trace Ge on interfacial IMC of Sn-0.7Cu solder under high soldering temperature

GAN Gui-Sheng

doi:10.13228/j.boyuan.issn1006-6543.20150109

MENG Guo-qi，CHEN Duan-feng，GAN Gui-sheng，，LIU Lu-ting，LIU Zhao-wei，WANG Qing-meng

Powder Metallurgy Industry ›› 2016, Vol. 26 ›› Issue (03) : 21-27.

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Powder Metallurgy Industry ›› 2016, Vol. 26 ›› Issue (03) : 21-27. DOI: 10.13228/j.boyuan.issn1006-6543.20150109

Effect of trace Ge on interfacial IMC of Sn-0.7Cu solder under high soldering temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 26(03): 21-27 https://doi.org/10.13228/j.boyuan.issn1006-6543.20150109

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Received	Revised	Published
2015-12-03	2016-03-02	2016-06-10
Issue Date
2016-06-12

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