Finite element analysis for the effective thermal conductivity of copper foam

LI Yu，SHEN Wei，ZHAO Peng，PU Yu-ping

Powder Metallurgy Industry ›› 2018, Vol. 28 ›› Issue (02) : 39-44.

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Powder Metallurgy Industry ›› 2018, Vol. 28 ›› Issue (02) : 39-44. DOI: 10.13228/j.boyuan.issn1006-6543.20160112

Finite element analysis for the effective thermal conductivity of copper foam

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 28(02): 39-44 https://doi.org/10.13228/j.boyuan.issn1006-6543.20160112

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