Study on the preparation and bonding properties of tungsten coating on oxygen-free copper substrate

ZHANG Dan-hua, QIN Si-gui, LIU Guo-hui

Powder Metallurgy Industry ›› 2019, Vol. 29 ›› Issue (02) : 21-23.

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Powder Metallurgy Industry ›› 2019, Vol. 29 ›› Issue (02) : 21-23. DOI: 10.13228/j.boyuan.issn1006-6543.20180009

Study on the preparation and bonding properties of tungsten coating on oxygen-free copper substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 29(02): 21-23 https://doi.org/10.13228/j.boyuan.issn1006-6543.20180009

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