Effect of Si content on the microstructure and mechanical properties of W/W-10Cu diffusion bonded joint

YAN Hai-xiang, FAN Jing-lian

Powder Metallurgy Industry ›› 2019, Vol. 29 ›› Issue (03) : 8-12.

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Powder Metallurgy Industry ›› 2019, Vol. 29 ›› Issue (03) : 8-12. DOI: 10.13228/j.boyuan.issn1006-6543.20190023

Effect of Si content on the microstructure and mechanical properties of W/W-10Cu diffusion bonded joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 29(03): 8-12 https://doi.org/10.13228/j.boyuan.issn1006-6543.20190023

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