High-power IGBT heat sink substrate melting ultra-high heat isostatic pressing preparation technology

XU Guang，FU Cai-an，QIAN Jing，GONG Hui-yu

Powder Metallurgy Industry ›› 2020, Vol. 30 ›› Issue (05) : 93-96.

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Powder Metallurgy Industry ›› 2020, Vol. 30 ›› Issue (05) : 93-96. DOI: 10.13228/j.boyuan.issn1006-6543.20190141

High-power IGBT heat sink substrate melting ultra-high heat isostatic pressing preparation technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 30(05): 93-96 https://doi.org/10.13228/j.boyuan.issn1006-6543.20190141

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