Cu modification for improving the interfacial stability of the solid-state Li batteries

YOU Zhiping, MA Hong, ZHAO ming

Powder Metallurgy Industry ›› 2025, Vol. 35 ›› Issue (3) : 149-155.

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Powder Metallurgy Industry ›› 2025, Vol. 35 ›› Issue (3) : 149-155. DOI: 10.13228/j.boyuan.issn1006-6543.20240033
Innovation and Communication

Cu modification for improving the interfacial stability of the solid-state Li batteries

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 35(3): 149-155 https://doi.org/10.13228/j.boyuan.issn1006-6543.20240033

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