集成电路用钛靶材和铜铬合金背板扩散焊接技术研究
董亭义，，户赫龙，于文军，何金江，吕保国，
Study on diffusion bonding technology of Ti target and CuCr alloy backplane for integrated circuit (IC)
DONG Ting- yi,,, HU He- long, YU Wen- jun, HE Jin- jiang, Lü Bao- guo,
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2017, (6): 23
-27
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DOI: 10. 13228/j. boyuan. issn1005- 8192. 2017037
