低温固化树脂基导电铜浆的制备及性能
武跟响, 赵传甲, 许荡, 陈鹏起, 程继贵
Preparation and properties of low temperature curing resin-based conductive copper paste
WU Genxiang, ZHAO Chuanjia, XU Dang, CHEN Pengqi, CHENG Jigui
金属功能材料
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2026, (1): 64
-71
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DOI: 10.13228/j.boyuan.issn1005-8192.20250035
