Abstract:OM, XRD, SEM and tensile testing were used to study the effects of brazing parameters on the intermetallic compounds (IMC) and mechanical properties of SnAg0.5CuZn0.1Ni/Cu lead-free solder joints. The results reveal that addition of 0.1%Ni (mass percent) can refine the primary β-Sn phase and eutectic structure of SnAg0.5CuZn solder alloy obviously. The maximum shear strength of 47 MPa is obtained from the joint soldered under the soldering temperature of 270 ℃ and soldering time of 240 s.
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