Abstract：OM， XRD， SEM and tensile testing were used to study the effects of brazing parameters on the intermetallic compounds (IMC) and mechanical properties of SnAg0.5CuZn0.1Ni/Cu lead-free solder joints. The results reveal that addition of 0.1%Ni (mass percent) can refine the primary β-Sn phase and eutectic structure of SnAg0.5CuZn solder alloy obviously. The maximum shear strength of 47 MPa is obtained from the joint soldered under the soldering temperature of 270 ℃ and soldering time of 240 s.
[1] Hongtao Ma, Jeffrey C. Suhling. A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci. 2009, 44, 1141-1158.[2] 李军, 胡宗保. 电子产品及电子器件绿色环保化. 电子器件, 2004, 27( 3) : 537- 542, 536. [3] 王春青, 王学林, 田艳红. SnAgCu无铅微焊点剪切力学性能的体积效应. 焊接学报, 2011, 32(4): 1-5.[4] 邹贵生, 闫剑锋, 母凤文, 等. 微连接和纳连接研究新进展. 焊接学报, 2011, 32(4): 107-112.[5] Liang Zhang, Song-bai Xue, Li-li Gao, et al. Effects of rare earths on properties and microstructures of lead-free solder alloys. J Mater Sci: Mater Electron. 2009, 20, 685-694.[6] Wenxing Dong, Yaowu Shi, Yongping Lei, et al. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. J Mater Sci: Mater Electron. 2009, 20, 1008–1017.[7] Chiangming Chuang, Po-Cheng Shih, Kwang-Lung Lin. Mechanical strength of Sn-3.5Ag-based solders and related bondings. Journal of Electronic Materials, 2004, 33, 1-6.[8] Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto. Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. J. Mater. Sci. 2008, 43, 3643-8.[9] 王文海, 王珺, 唐兴勇, 等. 添加微量高熔点金属对无铅焊料性能的影响. 电子元件与材料, 2005, 24(9): 48-51. [10] Keke Zhang, Yaoli Wang, Yan-Li Fan, et al. Sn-2.5Ag-0.7Cu-0.1Re-xNi lead-free solder alloy and its creep properties of solder joints. Materials Science Forum, 2010, 650, 91-96.[11] Keke Zhang, Chenyang Li, Yaoli Wang, et al. Effect of Ni on the growing of intermetallic compound in the interface of Sn2.5Ag0.7Cu0.1RE/Cu solder joint during aging. Materials Science and Technology, 2012, 28, 760-765.[12] Kwang-Lung Lin, Po-Cheng Shih. IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls. Journal of Alloys and Compounds, 2008 452, 291-297.
2017, Vol. 27 
