Abstract：Trace amounts of Pb existing in widespread lead-free soldering processes currently, may impact on microstructure and property of lead free solder. Effect of trace amounts of Pb on microstructure and property of microindentation of Sn9Zn solder was investigated by means of XRD、SEM and micro hardness tester etc. The results show that element Pb can make Sn9Zn solder microstructure significantly refined at the different content of Pb; indentation displacement relative decline 12 %, indentation hardness increased by 22%, reach to 0.31 GPa at Pb content （mass fraction） of 0.8 %, and the solder creep performance is improved at same time.
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WU Min, LI Jin-quan. Effect of Trace Amounts of Pb on Microstructure and Property of Microindentation of Sn9Zn Solder. , 2014, 21(5): 10-13.
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2014, Vol. 21 
