Preparation and properties of low temperature curing resin-based conductive copper paste

WU Genxiang; ZHAO Chuanjia; XU Dang; CHEN Pengqi; CHENG Jigui

doi:10.13228/j.boyuan.issn1005-8192.20250035

WU Genxiang, ZHAO Chuanjia, XU Dang, CHEN Pengqi, CHENG Jigui

Metallic Functional Materials ›› 2026, Vol. 33 ›› Issue (1) : 64-71.

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Metallic Functional Materials ›› 2026, Vol. 33 ›› Issue (1) : 64-71. DOI: 10.13228/j.boyuan.issn1005-8192.20250035

RESEARCH AND TECHNOLOGY

Preparation and properties of low temperature curing resin-based conductive copper paste

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 33(1): 64-71 https://doi.org/10.13228/j.boyuan.issn1005-8192.20250035

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