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Preparation and properties of low temperature curing resin-based conductive copper paste
WU Genxiang, ZHAO Chuanjia, XU Dang, CHEN Pengqi, CHENG Jigui
Metallic Functional Materials . 2026, (1): 64 -71 .  DOI: 10.13228/j.boyuan.issn1005-8192.20250035

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