Abstract：Effect of La on microstructure and property of microindentation of Sn3. 0Ag0. 5Cu was researched by adding rare earth elements to the solder by means of SEM 、 EDAX 、XRD 、microindentation instrument and so on. The results showed that La can remarkable refine microstructure of Sn3. 0Ag0. 5Cu solder，elements of La can make the Sn3. 0Ag0. 5Cu indentation depth is relatively decreased 17. 26%, indentation hardness increased by 19. 14%, reaching 0. 53 GPa as well. It is considered that La makes Sn3. 0Ag0. 5Cu solder microstructure into fine, which is the cause of solder microindentation obtained significant improvement.
邵晴，吴敏. 镧对Sn3. 0Ag0. 5Cu钎料组织及微米压痕性能影响[J]. , 2015, 22(2): 33-36.
SHAO Qing,WU Min. Effect of La on microstructure and property of microindentation of Sn3. 0Ag0. 5Cu. , 2015, 22(2): 33-36.
2015, Vol. 22 
